Technology
China’s CXMT Begins Mass Production of Advanced Memory Chips
China’s CXMT has announced mass production of its fifth-generation DRAM technology platform, marking a major development in the country’s domestic memory-chip manufacturing industry.
Chinese memory-chip manufacturer ChangXin Memory Technologies (CXMT) has announced that its fifth-generation DRAM technology platform has entered mass production. The development represents another step in China’s effort to expand domestic semiconductor manufacturing and compete in the global memory-chip market.
CXMT Begins Mass Production
CXMT said its fifth-generation DRAM technology platform has officially entered mass production, allowing the company to manufacture more advanced memory chips with higher density and improved production efficiency.
11.95-Nanometer Memory Technology
The new platform reduces memory-cell feature spacing to 11.95 nanometers and uses quadruple-patterning technology to create smaller and more densely packed structures.
New 24Gb LPDDR5X Memory Chips
CXMT introduced two 24-gigabit LPDDR5X products based on the new platform. The company says the chips can store 50% more data than its previous products and are designed for smartphones and other portable devices.
Higher Production Efficiency
CXMT says its fifth-generation platform can produce at least 50% more individual chip dies from each silicon wafer compared with its previous generation, potentially helping reduce manufacturing costs.
Competition With Samsung, SK Hynix and Micron
The development places CXMT in stronger competition with established memory-chip manufacturers including Samsung Electronics, SK Hynix and Micron, which dominate much of the global DRAM market.
China's Semiconductor Self-Reliance
CXMT's progress is part of China's broader effort to strengthen domestic semiconductor capabilities and reduce dependence on foreign technology and components.
CXMT, formally known as ChangXin Memory Technologies, is China's leading DRAM manufacturer. The company produces dynamic random-access memory used in smartphones, computers, tablets, servers and other electronic products. CXMT says it specializes in DRAM design, manufacturing, sales and research and development.
The company's latest announcement focuses on its fifth-generation DRAM technology platform. CXMT says the platform has now entered mass production, allowing the company to move from technology development into larger-scale commercial manufacturing. The company presented the technology at the 2026 World Manufacturing Convention in Hefei.
One of the key improvements is the reduction in memory-cell feature spacing to 11.95 nanometers. CXMT says it achieved this using quadruple-patterning technology. Smaller spacing allows memory structures to be packed more closely together, increasing the amount of data that can be stored on a chip.
CXMT also introduced two 24Gb LPDDR5X memory products based on the new platform. These products are aimed at smartphones and other portable electronics. According to the company, the new chips can store 50% more data than previous products while the platform is designed to improve manufacturing efficiency.
Another important claim from CXMT concerns wafer productivity. The company says its new platform can increase gross chip-die production per wafer by at least 50% compared with its previous generation. More dies from each wafer can potentially improve manufacturing economics and help reduce the cost of producing memory chips.
The announcement comes as CXMT expands its position in the global DRAM industry. TrendForce reported earlier in September that CXMT had also entered mass production of LPDDR6, with the new memory reaching data rates of up to 12,800 Mbps.
CXMT's progress is significant for China's semiconductor industry because DRAM is an important component in modern computing devices. Smartphones, PCs, servers and AI systems all depend on memory technologies to store and quickly access data during processing.
The company's development also comes amid continuing restrictions on China's access to some advanced semiconductor technologies and manufacturing equipment. CXMT's ability to develop and manufacture newer memory technologies domestically is therefore part of a wider effort to strengthen China's semiconductor supply chain.
CXMT is also expanding beyond conventional DRAM. Recent reports indicate the company has begun small-scale production of HBM3E, a type of high-bandwidth memory used with advanced AI processors. The Information reported that CXMT plans to expand this production in 2027, although the company has not publicly confirmed all of those reported plans.
The memory-chip market remains highly competitive. Samsung Electronics, SK Hynix and Micron are major global DRAM suppliers, while Chinese companies are increasing investment in domestic memory production. CXMT's latest manufacturing milestone could give Chinese electronics companies another source of advanced memory components.
Conclusion
China's CXMT has entered mass production of its fifth-generation DRAM technology platform, marking an important development in the country's memory-chip manufacturing industry. The company says the platform improves memory density, production efficiency and power characteristics while enabling new 24Gb LPDDR5X products. The development highlights China's continued efforts to strengthen its semiconductor supply chain and expand domestic alternatives in a highly competitive global memory market.
